L10 FRU PACKAGE DESIGN
A Field Replaceable Unit (FRU) package is a unit-level, protective packaging system engineered specifically for individual modular sub-assemblies such as power supply units (PSUs), hot-swap fan trays, route switch processors, GPU expansion cards, memory trays, and liquid-cooling cold plates that are serviced, upgraded, or replaced directly within a data center by field service engineers.
Chassis + Midplane + Fan bay + PDB module Packing
Unlike bulk packaging used to ship an entire assembled server chassis, an FRU package is engineered specifically to protect single spare parts moving through field service supply chains, warehousing, and staging.
Top View Perspective
Side View Perspective
Front View Perspective
Standard Architecture of a FRU Package
Modular FRU Packaging – 3-Layer Protection
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Outer: 44 ECT corrugated box for stacking strength.
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Cushioning: Custom ESD foam (EPE/EVA) for shock protection.
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Barrier: ESD shielding bag or MBB with desiccant and HIC for ESD and moisture control.
Fan Module Packing
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Inner Packaging Structure
Package Testing & Verification
A standardized qualification process that validates packaging performance under simulated shipping hazards, ensuring sensitive components such as GPUs, power supplies, fan trays, and switch processors remain protected throughout global distribution.
Inner Packaging Structure
Drop & Vibe Vertification
